LASER CUT UV

Description

The UV laser developed by LPKF, is perfect for precision cutting and working of different materials such as flexible PCBs, IC substrates, high density PCBs etc…

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Information and technical data
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Very high
hole quality

Productivity

Suitable for processing
on different materials

Large work area

Discover the whole range of our solutions of Laser Cut UV

GENERAL INFORMATION

Common applications include drilling through holes and / or blind holes, cutting coverlay, prepeg and polyamide.

Technical data

  • Laser Class: 1
  • Working area (X x Y x Z): 533mm x 610mm x 11mm (21 ″ x24 ″)
  • Format; max reel width: 533mm x 610mm (21 ″ x 24 ″); 500mm (19.6 ″)
  • Position Accuracy: +/- 20um (0.8 Mil)
  • Laser beam diameter: 20um (0.8 Mil)
  • Laser wavelength: 355nm
  • Power supply: 400VAC, 3-PHASE, 50-60 Hz, 16 A, 6.5 kVA
  • Cooling: Air-cooled (internal water-air cooling)
  • Outdoor temperature: 22 ° C +/- 2 ° C
  • Humidity: <60% (non-condensing)